Breadboard 170 Points Mini

The Mini Modular Breadboard (170 Points) is a compact, solderless prototyping tool perfect for small circuit builds and quick testing. With 170 tie points, it supports DIP ICs and discrete components with standard 2.54mm spacing. Its adhesive backing and M2 mounting holes make it easy to secure on any surface, and multiple units can be snapped together for expanded layouts.

Features:

• 170 contact points for quick circuit mock-ups

• Standard 0.1" (2.54mm) spacing for most ICs

• Peel-and-stick adhesive backing

• Two M2 mounting holes for secure placement

• Modular design—snap multiple boards together

• Dimensions: 47 × 35 × 10 mm

Applications:

• Arduino prototyping, sensor testing, educational kits, embedded systems, robotics

*image shown is real. Color may vary depending on stock.